PCB-Assembly

  Before soldering, apply flux to the pad and treat it with a soldering iron to avoid poor tin plating or oxidation of the pad, resulting in poor soldering. Generally, the chip does not need to be processed. Use tweezers to carefully place the PQFP chip on the PCB board, taking care not to damage the pins. Make it aligned with the pad and ensure that the chip is placed in the correct direction. Adjust the temperature of the soldering iron to more than 300 degrees Celsius, dip a small amount of solder on the tip of the soldering iron, press down the aligned chip with a tool, and add a small amount of solder to the two diagonal pins. Hold down the chip and solder the pins on the two diagonal positions to make the chip fixed and unable to move. After soldering the opposite corners, recheck the alignment of the chip position. If necessary, adjust or remove and realign the position on the PCB board. When starting to solder all the pins, add solder to the tip of the soldering iron, and a...

  After the production of FPC flexible boards is completed, the production of Hitech rigid flex pcb boards can be completed through the following processes. 1. Punching Drill holes on FR4 and PP film, and the design on the alignment hole is not the same as the general through hole. After the punching is completed, browning is required. 2. Riveting Laminate copper clad laminates, PP adhesives, and FPC circuit boards and place them neatly. The original old process is to laminate and pressing step by step, but it is a waste of time. After many attempts, we found that the stacking process can be completed once. 3. Laminate This is a relatively complete step in the production of rigid-flex pcb board. Most of the materials are integrated for the first time. First, the bottom layer is copper clad laminate and PP film, above are the FPC flexible board produced in the previous process, and a PP film is placed on the FPC flexible board, then place the last layer of copper clad laminate. All ...

  This article is for design guide about   heavy copper PCB   (heavy copper printed circuit board) and DFM (design for manufacturing) is the line width and line space for heavy copper PCB (heavy copper printed circuit board), meanwhile the DFM (design for manufacturing) is very important for heavy copper PCB (heavy copper printed circuit board) because most of PCB design guides will not meet heavy copper PCB (heavy copper printed circuit board). Many of PCB suppliers can manufacture PCB with 4 mil ~ 5mil line width and line space as min trace/space, but it is not meet the requests of heavy copper PCB (heavy copper printed circuit board), 3~ 4 mil circuit line width is always for 0.5 OZ or 1 OZ copper layer on PCB, but not for heavy copper PCB (heavy copper printed circuit board) (3 OZ ~ 30 OZ copper PCB), you know PCB manufacturer can’t do 3 mil line space for 30 OZ PCB, this is why PCB designer have to consider the DFM. Meanwhile, you can visit  heavy copper PCB ...

  At present, the mainstream circuit board assembly technology in the SMT industry should be reflow soldering. Of course, there are other circuit board soldering methods. Double-sided reflow can save the space of the circuit board, which means that smaller product can be achieved, so most of the double sided pcb boards seen on the market belong to the double-sided reflow process. Because the double-sided reflow process requires two reflows, there are some process limitations. The most common problem is that when the pcb board goes to the second reflow furnace, the parts on the first side will be affected by gravity and dropped, especially when the board flows to the reflow zone of the furnace at high temperature, below we will explain the precautions for the placement of parts in the double-sided reflow process: Firstly , smaller parts are recommended to be placed on the first side to pass through the reflow oven, because the deformation of the PCB will be smaller when the first si...