PCB-Assembly

  Heavy copper plate has the characteristics of carrying large current, reducing thermal strain, and good heat dissipation. 1. The heavy copper circuit board can carry large current In the case of a certain line width, increasing the copper thickness is equivalent to increasing the cross-sectional area of ​​the circuit, which can carry a larger current, so it has the characteristic of carrying a large current. 2. Heavy copper circuit boards reduce thermal strain Copper foil has a small electrical conductivity (also called electrical resistivity ), the temperature rise is small when a large current is passed, so it can reduce the amount of heat and thereby reduce the thermal strain. Metal “conductors” are divided into: ” silver→copper→gold→aluminum→tungsten→nickel→iron ” according to conductivity. 3. The heavy copper circuit board has good heat dissipation Copper foil has high thermal conductivity (thermal conductivity 401W/mK), which can play an important role in improving heat dis...

Rogers laminates are high-performance laminated materials with various models suitable for different application scenarios. The following is information about the parameters of Rogers laminates: High-Frequency Performance Rogers laminates exhibit excellent dielectric properties and can withstand high-frequency signal transmission. For example, RO3203 has a dielectric constant of 3.02 and can be used in the frequency range up to 40GHz. RO3206 and RO3210 have dielectric constants of 6.15 and 10.2 respectively, making them suitable for frequency ranges above 20GHz. Material Composition Rogers laminates typically consist of ceramic-filled and woven glass fabric-reinforced polytetrafluoroethylene (PTFE) laminates. These materials feature low loss, high impedance matching, and high signal transmission speed. Physical Properties The physical properties of Rogers laminates include good mechanical performance such as high strength, high rigidity, heat resistance, and chemical corrosion resistan...

  1. High efficiency High-frequency PCB boards with small dielectric constants will have very low losses, and advanced induction heating technology can achieve the target heating requirements with very high efficiency. Of course, while focusing on efficiency, it also has the characteristics of environmental protection, which is very suitable for the development direction of today’s society. 2. Fast transmission speed The transmission speed is inversely proportional to the square root of the dielectric constant, which means that the smaller the dielectric constant, the faster the transmission speed. This is the advantage of the high-frequency printed circuit board. It uses special materials, which not only guarantees the low dielectric constant, but also maintains the stable operation, which is very important for signal transmission. 3. Large degree of controllability High frequency PCB board is widely used in various industries that require precision metal material heating treatmen...

  Distance between through-hole components and SMD components As shown in the figure above, a sufficient distance should be maintained between through-hole resistors and SMD components, preferably 1-3mm. Currently, through-hole components are rarely used due to the complexity of processing. Heat dissipation considerations when pads are in a solid copper area If a pad is located in a solid copper area, the connection between the pad and the solid copper should follow the method on the right. Additionally, the number of connecting wires (1 or 4) should be determined based on the current. Using the method on the left may cause difficulties in soldering or removing components during maintenance, as heat will be dispersed through the solid copper, making it hard to reach the required temperature. Teardrops required when wires are narrower than through-hole pads If the wire width is narrower than the pad of a through-hole component, teardrops should be added as shown in the method on the...

  The width of the bridge is too small when the panel - joining method is bridge - connection. The center - to - center spacing of the break - away holes is too close when using break - away holes for connection. When the board is thin and VCUT is required, double - sided VCUT is adopted. The external tension and stress are not well - considered during panelization. The copper layer distribution inside the board is uneven. Solutions For bridge - connected panels, the width of the bridge should be set according to the board thickness. The thinner the board, the fewer the number of panels should be, and the wider the bridge should be. For panels connected by break - away holes, the size and center - to - center spacing of the break - away holes should be designed according to the designed width of the bridge and the board thickness. The thinner the board, the wider the bridge, the smaller the break - away holes should be, the larger the center - to - center spacing should be, and the...

  FPC (Flexible Printed Circuit) is a printed circuit board made of polyimide or polyester film as the base material, featuring high wiring density, light weight, and thin thickness. It is mainly used in products such as mobile phones, tablets, medical devices, LEDs, automotive electronics, smart wearables, etc. FPC can be classified into single-sided FPC, double-sided FPC, multilayer FPC, and rigid-flex FPC. Single-Sided FPC It has a layer of conductive patterns formed by chemical etching, with the conductive layer being rolled copper foil. Insulating substrates can be polyimide, polyethylene terephthalate, aramid fiber ester, or polyvinyl chloride. Single-sided FPC is further divided into four subcategories: Single-Sided Connection without Cover Layer Conductive patterns are on the insulating substrate without a cover layer. Interconnection is achieved by soldering, fusion welding, or pressure welding. Single-Sided Connection with Cover Layer Similar to the non-covered type, bu...