Reasons for PCB Panel - breaking or Warping after Panelization

 

  • The width of the bridge is too small when the panel - joining method is bridge - connection.
  • The center - to - center spacing of the break - away holes is too close when using break - away holes for connection.
  • When the board is thin and VCUT is required, double - sided VCUT is adopted.
  • The external tension and stress are not well - considered during panelization.
  • The copper layer distribution inside the board is uneven.

Solutions

  • For bridge - connected panels, the width of the bridge should be set according to the board thickness. The thinner the board, the fewer the number of panels should be, and the wider the bridge should be.
  • For panels connected by break - away holes, the size and center - to - center spacing of the break - away holes should be designed according to the designed width of the bridge and the board thickness. The thinner the board, the wider the bridge, the smaller the break - away holes should be, the larger the center - to - center spacing should be, and the fewer the number of panels should be.
  • When the board thickness is less than 0.6MM, single - sided VCUT should be used as much as possible.
  • During circuit design, the area distribution and symmetry of the upper and lower copper layers should be ensured as much as possible.
  • For boards with large shape differences, the method of process edges should be used as much as possible to balance the influence of external tension and stress on board warping.

If you’re interested in PCB&PCBA products, pls kindly email to Sandy: sales9@hitechpcb.com



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