PCB-Assembly

  The SMT assembly processing factory says that SMT refers to the abbreviation of a series of technological processes based on SMT for processing. Generally, the electronic products we use are designed according to the pre - designed circuit diagrams by combining SMT with various electronic components such as capacitors and resistors. Therefore, different electrical appliances require different SMT chip processing technologies. The SMT processing manufacturer says that the following points should be noted during the repair of high - precision SMT assemblies: Manual soldering should follow the principle of starting with small components first and then large ones, and starting with low - profile components first and then high - profile ones. Soldering should be carried out in batches and by category. First, solder chip resistors, chip capacitors, and transistors, then small IC devices and large IC devices, and finally, solder through - hole components. When soldering chip components,...

  Let's first clarify the colors and then move on to the precious metals used on PCBs. Some manufacturers will specifically mention that their products adopt special processes such as gold - plating and silver - plating when promoting their products. So, what are the uses of such processes? The surface of a PCB needs to have components soldered on it, which requires a part of the copper layer to be exposed for soldering. These exposed copper layers are called solder pads. Solder pads are generally rectangular or circular and have a small area. As we know, the copper used in PCBs is extremely prone to oxidation. Therefore, after applying the solder mask, the only copper exposed to the air is on the solder pads. If the copper on the solder pads is oxidized, it will not only be difficult to solder but also have a significantly increased resistivity, seriously affecting the performance of the final product. So, engineers have come up with various ways to protect the solder pads. For ex...

  PCB, SMT and PCBA are key terms in the electronics manufacturing process, which stand for circuit board, surface mount technology and assembled circuit board respectively. In this article, we will explore the connections and differences between them in detail. PCBS are one of the most common components in electronic devices. It is usually made of a non-conductive material (usually paper, fiberglass, or plastic) on which a wire connection is formed between electronic components. The design of the PCB can be carried out on the computer and generated during the manufacturing process. The designer converts the circuit diagram into a physical layout, which is then transmitted to the manufacturer using CAD software and finally generated through the manufacturing process. SMT is a technology that pastes the surface of a component onto a PCB. In traditional PCB manufacturing methods, components are usually attached to the board via nails or welded pins. However, SMT technology replaces t...

  FPC (flexible circuit board) design involves many key aspects, including material selection, layout design, reinforcement design, etc. Here are some of the main points of FPC design: ‌ ‌ Material selection ‌ : Side keys and main keys are usually selected 18/12.5 double-sided electrolytic copper, to ensure that there is no abnormality in bending more than 8 times. The connection line also uses 18/12.5 double-sided electrolytic copper to meet the connection needs. In terms of the material selection of sliding cover plate, the double-layer sliding cover plate uses 1/30Z single-sided copper-free electrolytic copper, while the double-sided sliding cover plate uses 1/30Z double-sided copper-free electrolytic copper to ensure the flexibility and ductility. The multilayer plate is made of 1/30Z non-gel electrolytic copper to ensure softness and ductility. The choice of auxiliary materials such as adhesive paper depends on whether ‌SMT (surface mount technology) is required to determine w...