SMT factory: What should we pay attention to in SMT assembly repair ?

 The SMT assembly processing factory says that SMT refers to the abbreviation of a series of technological processes based on SMT for processing. Generally, the electronic products we use are designed according to the pre - designed circuit diagrams by combining SMT with various electronic components such as capacitors and resistors. Therefore, different electrical appliances require different SMT chip processing technologies. The SMT processing manufacturer says that the following points should be noted during the repair of high - precision SMT assemblies:

Manual soldering should follow the principle of starting with small components first and then large ones, and starting with low - profile components first and then high - profile ones. Soldering should be carried out in batches and by category. First, solder chip resistors, chip capacitors, and transistors, then small IC devices and large IC devices, and finally, solder through - hole components.

When soldering chip components, the width of the soldering tip should be the same as that of the component. If it is too small, it will be difficult to position during assembly and soldering.

When soldering devices with pins on both sides or four sides such as SOP, QFP, and PLCC, several positioning points should be soldered on both sides or four sides. After carefully checking and confirming that each pin corresponds to the corresponding pad, drag soldering can be carried out to complete the soldering of the remaining pins. Do not drag the soldering too fast. It is advisable to drag one solder joint in about 1 second.

After soldering, use a magnifying glass to check 4 - 6 times whether there is bridging between the solder joints. At the place where there is bridging, dip a little flux with a brush and then drag - solder again. The soldering of the same part should not be carried out continuously more than twice. If the soldering is not completed at one time, wait for it to cool down before soldering again.

When soldering IC devices, evenly apply a layer of solder paste on the pads. This can not only wet and solder the solder joints but also greatly facilitate the maintenance work and improve the maintenance speed.

The SMT assembly processing factory says that there are strict requirements for the temperature and humidity management in the SMT assembly processing workshop. The main purpose is to ensure the quality of SMT soldering and improve the production efficiency of SMT assembly processing. A suitable temperature and humidity environment in the workshop is one of the important factors to ensure the quality of SMT soldering. If the environmental conditions in the workshop are not well - controlled, the electronic product components and soldering effects may be damaged, and finally, the entire SMT circuit will malfunction. Here is the introduction from the SMT processing manufacturer:

High humidity in the manufacturing environment can cause many serious problems. For example, if the solder paste absorbs too much moisture, it is easy to cause bridging short - circuits, solder balls, and bubbles (especially for BGA solder joints) during reflow soldering. The flux in the solder paste volatilizes too quickly, causing the solder paste to dry out. During the printing process, it is easy to cause phenomena such as missed printing, insufficient solder, and sharp points. Excessively high temperature may cause partial oxidation of the solder paste, volatilization of the flux, and even affect the SMT soldering effect.

Non - compliance with temperature and humidity standards has a great impact on the overall quality of SMT chip manufacturing. Therefore, we need to control the temperature and humidity in the SMT chip processing workshop. For how to control them, you can contact our SMT assembly processing factory. We have many years of experience in this industry. For furhter information, pls feel free to contact us: sales9@hitechpcb.com,Website: www.hitechpcb.com








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