The following factors affect the quality of circuit board soldering processing

 

Circuit boards, as vital parts of electronic industrial products, see extensive applications in the electronics industry, necessitating rigorous production techniques.

During circuit board soldering, poor soldering directly impacts the stability of circuit components, causing defects in the board. In particular, unstable or non-conductive inner layers of the circuit board can directly lead to overall circuit failures, rendering the board inoperable.

The composition and properties of soldering materials directly affect soldering quality. Key materials include electrodes, solder, and other related soldering components. Additionally, chemical reactions—critical to the soldering process—play a primary role in connecting circuit boards as conductive pathways.

There are multiple soldering methods for circuit boards, and the selection should be based on specific conditions, mainly the melting point of the solder. It is crucial to avoid improper material selection.

During the soldering process, the selected melting point should be higher than that of the solder. White rosin and isopropyl alcohol solvents are commonly chosen as flux for circuit boards. Flux features thermal conductivity and causes significant corrosion to circuit boards. Additionally, it wets the surface to facilitate soldering onto the circuit board.

The cleanliness of the circuit board's surface during trace connection directly affects soldering quality. If the surface is insufficiently clean, the solder wire will directly form solder balls, which lack luster.

Excessively high temperatures during soldering will increase the melting rate and activity of the solder. This accelerates the oxidation reaction between the circuit board and molten solder, ultimately causing the soldering quality to fail to meet requirements.

If you want to know about PCB&PCBA pls contact Sandy at sales9@hitechcircuits.com

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