What factors can affect the quality of PCBA wave soldering?

 

Wave soldering is a welding method in PCBA processing, mainly used for plug-in and mixed assembly processes. The final soldering quality in wave soldering is affected by factors such as wave soldering equipment, soldering materials, and PCB boards. Let's take a detailed look:

1.Wave Soldering Equipment Factors

Equipment issues are one of the main factors affecting wave soldering quality, primarily including:

  1. Flux spraying: Timely clean and replace the flux nozzle, and reasonably set the spraying time to avoid uneven flux application, which can cause soldering defects.
  2. Temperature control in heating zones: Wave soldering typically has four zones (preheating, heating-up, high-temperature, and cooling). Each zone requires precise temperature and time settings to prevent issues like solder splashing.
  3. Conveyor stability: A stable conveyor ensures consistent component positioning during soldering.

2.Soldering Material Factors

  1. Solder materials: Wave soldering uses solder bars (different from reflow soldering). The composition ratio and impurity content of solder bars directly impact soldering quality.
  2. Flux performance: Inadequate flux activity reduces solder wettability and fails to clean the soldering surface, leading to issues like incomplete solder joints.

3.Component and PCB Factors

  1. Component defects: Oxidized or oil-contaminated leads/plating can cause cold soldering.
  2. PCB issues: Oxidized pads, uneven board surfaces, or moisture absorption from improper storage will result in soldering defects (e.g., cold joints, solder balls, voids).

Additional factors: PCB design (e.g., pad spacing) and production process flaws also influence soldering quality. Controlling these aspects ensures high-quality wave soldering in PCBA manufacturing.

Want to know more? Contact me at sales9@hitechpcb.com. From Sandy

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