What factors can affect the quality of PCBA wave soldering?

 Wave soldering is a welding method in PCBA processing, mainly used for plug-in and mixed assembly processes. The final soldering quality in wave soldering is affected by factors such as wave soldering equipment, soldering materials, and PCB boards. Let's take a detailed look:

一、Wave Soldering Equipment Factors

Equipment issues are one of the main factors affecting wave soldering quality, primarily including:

  1. Flux spraying: Timely clean and replace the flux nozzle, and reasonably set the spraying time to avoid uneven flux application, which can cause soldering defects.
  2. Temperature control in heating zones: Wave soldering typically has four zones (preheating, heating-up, high-temperature, and cooling). Each zone requires precise temperature and time settings to prevent issues like solder splashing.
  3. Conveyor stability: A stable conveyor ensures consistent component positioning during soldering.

二、Soldering Material Factors

  1. Solder materials: Wave soldering uses solder bars (different from reflow soldering). The composition ratio and impurity content of solder bars directly impact soldering quality.
  2. Flux performance: Inadequate flux activity reduces solder wettability and fails to clean the soldering surface, leading to issues like incomplete solder joints.

三、Component and PCB Factors

  1. Component defects: Oxidized or oil-contaminated leads/plating can cause cold soldering.
  2. PCB issues: Oxidized pads, uneven board surfaces, or moisture absorption from improper storage will result in soldering defects (e.g., cold joints, solder balls, voids).

Additional factors: PCB design (e.g., pad spacing) and production process flaws also influence soldering quality. Controlling these aspects ensures high-quality wave soldering in PCBA manufacturing.

Want to know more? Contact me at sales9@hitechpcb.com. From Sandy



Comments

Post a Comment

Popular posts from this blog

How to solder the flexible PCB board?

  Before soldering, apply flux to the pad and treat it with a soldering iron to avoid poor tin plating or oxidation of the pad, resulting in poor soldering. Generally, the chip does not need to be processed. Use tweezers to carefully place the PQFP chip on the PCB board, taking care not to damage the pins. Make it aligned with the pad and ensure that the chip is placed in the correct direction. Adjust the temperature of the soldering iron to more than 300 degrees Celsius, dip a small amount of solder on the tip of the soldering iron, press down the aligned chip with a tool, and add a small amount of solder to the two diagonal pins. Hold down the chip and solder the pins on the two diagonal positions to make the chip fixed and unable to move. After soldering the opposite corners, recheck the alignment of the chip position. If necessary, adjust or remove and realign the position on the PCB board. When starting to solder all the pins, add solder to the tip of the soldering iron, and a...
Read more

How is the cost of SMT patch soldering calculated

The calculation of SMT patching prices is now almost transparent, and the algorithm for determining the cost per point is straightforward. However, it is first necessary to clarify the concept of "point". Different companies adopt varying algorithms, but for a PCB board, the total cost of SMT patching processing remains consistent. The core of SMT patching processing is to mount surface - mount components onto the solder pads of a PCB. Some companies count one solder pad as one point, while others consider two solder pads as one point. In this article, we take the example of calculating one point per solder pad. It only requires calculating all the solder pads on the PCB board. However, for some special components such as inductors, large capacitors, ICs, etc., additional calculations are needed. The specific empirical methods are as follows: for example, an inductor can be counted as 10 points, and an IC is calculated as half the number of pins (for example, a 40 - pin IC is...
Read more

How can we identify Integrated Circuits board and PCBA

  Inspect the surface of the PCB component body If a used  circuits board   part has been polished to make it look new, there may be tiny scratch patterns on the surface when observed under a magnifier. If it is covered up with paint on the surface, it will look bright and have no plastic texture. Inspect the printed text High-quality producers use laser printers to print the text silk-screen. It has a clear appearance, is non-conspicuous, and is difficult to erase. Typically, the text on refurbished chips is printed fuzzy and is not as sharp. You may find that the edges of the characters are blurred. The characters may be offset and the shades and colors may not be uniform. Moreover, many re-furbished chips use stencils for re-printing. In this case, if you feel the printed text, it should be easy to tell if it is new or refurbished. Inspect component pins If the component pins are shiny with a thin coating, then it may be refurbished. Original components are tin plated,...
Read more