PCB-Assembly

  With the development of technology and the improvement of living standards, the pursuit of electronic products is increasingly trending towards miniaturization and precision. In SMT small-batch patching processing plants, traditional DIP plug-ins no longer play as significant a role in small, compact PCBA as SMT patching, especially for large-scale and highly integrated ICs. The precision industry requires meticulous attention to both material usage and processing steps, as even the slightest error can render the entire device inoperable. Therefore, every step in the patching process must be carefully observed. SMT patching processing, namely Surface Mount Technology (SMT), is the most popular technology and process in the current electronic assembly industry. Surface Mount Technology for electronic circuits, also known as surface mounting or surface installation technology, primarily aims to accurately mount surface-mounted components onto fixed positions of a PCB. However, duri...

The calculation of SMT patching prices is now almost transparent, and the algorithm for determining the cost per point is straightforward. However, it is first necessary to clarify the concept of "point". Different companies adopt varying algorithms, but for a PCB board, the total cost of SMT patching processing remains consistent. The core of SMT patching processing is to mount surface - mount components onto the solder pads of a PCB. Some companies count one solder pad as one point, while others consider two solder pads as one point. In this article, we take the example of calculating one point per solder pad. It only requires calculating all the solder pads on the PCB board. However, for some special components such as inductors, large capacitors, ICs, etc., additional calculations are needed. The specific empirical methods are as follows: for example, an inductor can be counted as 10 points, and an IC is calculated as half the number of pins (for example, a 40 - pin IC is...

  Wave soldering is a welding method in PCBA processing, mainly used for plug-in and mixed assembly processes. The final soldering quality in wave soldering is affected by factors such as wave soldering equipment, soldering materials, and PCB boards. Let's take a detailed look: 1.Wave Soldering Equipment Factors Equipment issues are one of the main factors affecting wave soldering quality, primarily including: Flux spraying : Timely clean and replace the flux nozzle, and reasonably set the spraying time to avoid uneven flux application, which can cause soldering defects. Temperature control in heating zones : Wave soldering typically has four zones (preheating, heating-up, high-temperature, and cooling). Each zone requires precise temperature and time settings to prevent issues like solder splashing. Conveyor stability : A stable conveyor ensures consistent component positioning during soldering. 2.Soldering Material Factors Solder materials : Wave soldering uses solder bars (diffe...

  Circuit boards, as vital parts of electronic industrial products, see extensive applications in the electronics industry, necessitating rigorous production techniques. During circuit board soldering, poor soldering directly impacts the stability of circuit components, causing defects in the board. In particular, unstable or non-conductive inner layers of the circuit board can directly lead to overall circuit failures, rendering the board inoperable. The composition and properties of soldering materials directly affect soldering quality. Key materials include electrodes, solder, and other related soldering components. Additionally, chemical reactions—critical to the soldering process—play a primary role in connecting circuit boards as conductive pathways. There are multiple soldering methods for circuit boards, and the selection should be based on specific conditions, mainly the melting point of the solder. It is crucial to avoid improper material selection. During the soldering p...

  After the production of FPC flexible boards is completed, the production of Hitech rigid flex pcb boards can be completed through the following processes. 1. Punching Drill holes on FR4 and PP film, and the design on the alignment hole is not the same as the general through hole. After the punching is completed, browning is required. 2. Riveting Laminate copper clad laminates, PP adhesives, and FPC circuit boards and place them neatly. The original old process is to laminate and pressing step by step, but it is a waste of time. After many attempts, we found that the stacking process can be completed once. 3. Laminate This is a relatively complete step in the production of rigid-flex pcb board. Most of the materials are integrated for the first time. First, the bottom layer is copper clad laminate and PP film, above are the FPC flexible board produced in the previous process, and a PP film is placed on the FPC flexible board, then place the last layer of copper clad laminate. All ...

  Generally speaking, the PCB aluminum substrate is composed of a circuit layer, a thermally conductive insulating layer and a metal base layer; it can be divided into three layers: Circuit layer : equivalent to the copper clad laminate of an ordinary PCB, the thickness of the circuit copper foil is 1 to 10 oz. The circuit layer (that is, copper foil) is usually etched to form a printed circuit to connect the various components of the assembly. Generally, the circuit layer requires a large current-carrying capacity, so thicker copper foil should be used, with a thickness of 35μm~ 280μm; Insulation layer : The insulation layer is a layer of low thermal resistance thermally conductive insulating material. The thickness is 0.003 to 0.006 inches. It is generally composed of a special polymer filled with special ceramics. It has low thermal resistance, excellent viscoelasticity, thermal aging resistance, and can withstand mechanical and thermal stress. It is the core technology of alumi...

  It is more suitable for SMT process; Meet the requirements of RoHs; The heat dissipation has been effectively treated, thereby reducing the operating temperature of the module, prolonging the service life and improving the reliability; The volume is decreasing, reducing the assembly area of ​​radiators and other hardware, reducing product volume, and reducing hardware and assembly costs; Good mechanical durability, better than ceramic circuit boards made by some simple processes. Disadvantages of aluminum pcb printed circuit boards Higher cost: Compared with other cheap PCB products, the price of aluminum-based PCB boards accounts for 30% of the total product price. At present, the mainstream manufacturer can only make single-sided PCB boards, and it is difficult to make double-sided aluminum PCB boards. At present, single-sided aluminum PCB boards are relatively skilled in China, and the process and technology of multi-layer aluminum PCB boards are relatively mature in fore...

1. High efficiency High-frequency PCB boards with small dielectric constants will have very low losses, and advanced induction heating technology can achieve the target heating requirements with very high efficiency. Of course, while focusing on efficiency, it also has the characteristics of environmental protection, which is very suitable for the development direction of today’s society. 2. Fast transmission speed The transmission speed is inversely proportional to the square root of the dielectric constant, which means that the smaller the dielectric constant, the faster the transmission speed. This is the advantage of the high-frequency printed circuit board. It uses special materials, which not only guarantees the low dielectric constant, but also maintains the stable operation, which is very important for signal transmission. 3. Large degree of controllability High frequency PCB board is widely used in various industries that require precision metal material heating treatment. In ...